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Hosted by:

Organized by:

SiliconPV Award Sponsor

Media Partners

Scientific Topics

  • Silicon material and defect engineering
  • Wafering technologies
  • Junction formation
  • Cleaning, etching, surface morphology and surface passivation
  • Carrier selective contacts and contact formation
  • Advanced light management
  • Advanced characterization and simulation
  • Process integration and low-cost manufacturing
  • Si-based tandem cells, new materials and novel approaches
  • Module processing and materials
  • Module reliability and production yield
  • High and record efficiency devices
  • NEW: Review papers (for more information click here)

     

 

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Dates & Deadlines

Submission of abstracts: 16 November 2018
Notification of acceptance: 14 January 2019
Start of online registration: 25 January 2019
End of early bird discount: 1 March 2019
Deadline for full papers: 11 April 2019

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