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Hosted by:

Organized by:

Supported by:

Scientific Topics


  • Silicon material and defect engineering
  • Wafering technologies
  • Junction formation
  • Cleaning, etching, surface morphology and surface passivation
  • Carrier selective contacts and contact formation
  • Advanced light management
  • Advanced characterization and simulation
  • Process integration and low-cost manufacturing
  • Si-based tandem cells, new materials and novel approaches
  • Module processing and materials
  • Module reliability and production yield
  • High and record efficiency devices





Linked to:

Dates & Deadlines:

Call for abstracts: 01.09.2017

Deadline for abstracts: 10.11.2017

Notification of Acceptance: 11.01.2018

Start of online registration: 11.01.2018 

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